Advanced thermal imaging and measurement techniques: application to a printed circuit board
Küçük Resim Yok
Tarih
2009
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Maltepe Üniversitesi
Erişim Hakkı
CC0 1.0 Universal
info:eu-repo/semantics/openAccess
info:eu-repo/semantics/openAccess
Özet
Thermal management is vital to the successful design, manufacturing and operation of the most modern electronic systems. The objective of this paper is to describe an experimental setup using an infrared camera system to characterize thermal behavior of the electronic components. A comparison is given for the use of two different coatings to create a uniform surface emissivity within a variety of experimental situations. New oil based heat sink has been implemented. The effect of oil flow regime has also been presented. In addition, three dimensional thermal simulation of the device under test has been performed and the results obtained were compared to experimental test results.
Açıklama
Anahtar Kelimeler
Kaynak
International Conference of Mathematical Sciences
WoS Q Değeri
Scopus Q Değeri
Cilt
Sayı
Künye
Mohammadi, F. A., Farrokhi, F. ve Yagoub, M. C. E. (2009). Advanced thermal imaging and measurement techniques: application to a printed circuit board. Maltepe Üniversitesi. s. 159.
