Advanced thermal imaging and measurement techniques: application to a printed circuit board
dc.contributor.author | Mohammadi, F. A. | |
dc.contributor.author | Farrokhi, F. | |
dc.contributor.author | Yagoub, M. C. E. | |
dc.date.accessioned | 2024-07-12T20:56:16Z | |
dc.date.available | 2024-07-12T20:56:16Z | |
dc.date.issued | 2009 | en_US |
dc.department | Maltepe Üniversitesi, İnsan ve Toplum Bilimleri Fakültesi | en_US |
dc.description.abstract | Thermal management is vital to the successful design, manufacturing and operation of the most modern electronic systems. The objective of this paper is to describe an experimental setup using an infrared camera system to characterize thermal behavior of the electronic components. A comparison is given for the use of two different coatings to create a uniform surface emissivity within a variety of experimental situations. New oil based heat sink has been implemented. The effect of oil flow regime has also been presented. In addition, three dimensional thermal simulation of the device under test has been performed and the results obtained were compared to experimental test results. | en_US |
dc.identifier.citation | Mohammadi, F. A., Farrokhi, F. ve Yagoub, M. C. E. (2009). Advanced thermal imaging and measurement techniques: application to a printed circuit board. Maltepe Üniversitesi. s. 159. | en_US |
dc.identifier.endpage | 160 | en_US |
dc.identifier.isbn | 9.78605E+12 | |
dc.identifier.startpage | 159 | en_US |
dc.identifier.uri | https://hdl.handle.net/20.500.12415/2951 | |
dc.language.iso | en | en_US |
dc.publisher | Maltepe Üniversitesi | en_US |
dc.relation.ispartof | International Conference of Mathematical Sciences | en_US |
dc.relation.publicationcategory | Uluslararası Konferans Öğesi - Başka Kurum Yazarı | en_US |
dc.rights | CC0 1.0 Universal | * |
dc.rights | info:eu-repo/semantics/openAccess | en_US |
dc.rights.uri | http://creativecommons.org/publicdomain/zero/1.0/ | * |
dc.snmz | KY07675 | |
dc.title | Advanced thermal imaging and measurement techniques: application to a printed circuit board | en_US |
dc.type | Conference Object | |
dspace.entity.type | Publication |