Advanced thermal imaging and measurement techniques: application to a printed circuit board

dc.contributor.authorMohammadi, F. A.
dc.contributor.authorFarrokhi, F.
dc.contributor.authorYagoub, M. C. E.
dc.date.accessioned2024-07-12T20:56:16Z
dc.date.available2024-07-12T20:56:16Z
dc.date.issued2009en_US
dc.departmentMaltepe Üniversitesi, İnsan ve Toplum Bilimleri Fakültesien_US
dc.description.abstractThermal management is vital to the successful design, manufacturing and operation of the most modern electronic systems. The objective of this paper is to describe an experimental setup using an infrared camera system to characterize thermal behavior of the electronic components. A comparison is given for the use of two different coatings to create a uniform surface emissivity within a variety of experimental situations. New oil based heat sink has been implemented. The effect of oil flow regime has also been presented. In addition, three dimensional thermal simulation of the device under test has been performed and the results obtained were compared to experimental test results.en_US
dc.identifier.citationMohammadi, F. A., Farrokhi, F. ve Yagoub, M. C. E. (2009). Advanced thermal imaging and measurement techniques: application to a printed circuit board. Maltepe Üniversitesi. s. 159.en_US
dc.identifier.endpage160en_US
dc.identifier.isbn9.78605E+12
dc.identifier.startpage159en_US
dc.identifier.urihttps://hdl.handle.net/20.500.12415/2951
dc.language.isoenen_US
dc.publisherMaltepe Üniversitesien_US
dc.relation.ispartofInternational Conference of Mathematical Sciencesen_US
dc.relation.publicationcategoryUluslararası Konferans Öğesi - Başka Kurum Yazarıen_US
dc.rightsCC0 1.0 Universal*
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.rights.urihttp://creativecommons.org/publicdomain/zero/1.0/*
dc.snmzKY07675
dc.titleAdvanced thermal imaging and measurement techniques: application to a printed circuit boarden_US
dc.typeConference Object
dspace.entity.typePublication

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